Our methods for analysis are derived from the EPA Standards for Water Analysis.
Analysis of the Chemistry used in the manufacturing of Printed Circuit Boards.
Metal Finishing/ Plating on Plastics
Analysis of the Chemistry used in the Metal Finishing Industry and Plating on Plastics.
Analytical Testing Overview
Trace Metals- detection and quantification of low levels of metals for quality control or regulatory compliance; Ag, As, Be, Ca, Cd, Co, Cr, Cs, Cu, Fe, Ga, Ge etc.
TOC/IC-Total Organic Carbon, Total Inorganic Carbon, Total Carbon
Additional Tests- Ammonia, Alkalinity, Bacteria, Carbonates, Chlorides, Conductivity, Cyanide, Dissolved Oxygen, Hardness, pH, Sulfites, TDS, TSS
PCB Process Chemistry- Solvents, Permanganate, Neutralizers, Conditioners, Microetches, Electroless Copper, Electroplated Copper, T&E, Copper Purity, TOC, Electroplated Nickel & Gold, ENIG and ENIPIG Process Chemistry, Electroplated Tin & Tin/Lead, Alternative Oxides, Peel Strength- resin to metal adhesion
Metal Finishing/POP- Electroplated Nickel, Electroplated Gold, Electroplated Tin, Electroplated Silver, Electroless Nickel, Copper Cyanide, Electroplated Tin (Sulfate)
Lubricants- TBN, TAN (ASTM D4739, D664)
Instrumentation- ICP-OES, TOC Analyzer, UV-VIS, Potentiometric Titration, Tensile, Elongation, Peel Strength Tester, Wet Titration Methods